3D SPI can completely solve the problem of shadow and random reflection in the detection process, so that solder paste 3D detection
accuracy is higher; equipped with a 5M pixel high-speed camera, detection speed is faster, the image is more delicate and rich; it is an ideal
choice for high-speed and high-precision production lines.
TECHNICAL PARAMETERS:
| Model | A510 | A510DL | A1200 |
| PCB Size | 55*55 ~450*450mm | 55*55 ~450*310mm Dual | 55*55 ~ 1200*650mm |
| PCB Tickness | 0.5 ~ 7.0mm | ||
| PCB Weight | ≤5.0kg | ||
| Conveyor Adjustment | Manual/automatic | ||
| Measure Type | Height,Area,Volume,Offset,Bridge,Shape(missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination) | ||
| Paste Height | 0 ~ 550um | ||
| Min Pad Pitch | ≥100um | ||
| Measure Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation, Phase Measurement Profilometry) | ||
| Inspection Head Quantity | 1 | ||
| Camera Pixel | 5M, (10M/12M as option) | ||
| Detection Speed | 0.35 ~ 0.5s/FOV | ||
| Program Time | 5 ~ 10min | ||
| Data Type | Gerber Data 274D/274X, Scan PCB | ||
| Power | AC220,50/60Hz,1KVA | ||
| Machine Dimension | 1000*1150*1530mm | 1000*1350*1530mm | 1730*1420*1530mm |
| Weight | 965kg | 1200kg | 1600kg |
Core Technology and Features
1.PROGRAMMABLE STRUCTURED GRATING PMP IMAGING TECHNOLOGY
Phase modulation profiling technology (PMP) is used to achieve three-dimensional measurement of printed solder paste, which can greatly improve measurement accuracy while ensuring high-speed inspection.
It provides a variety of detection accuracy of 2.8μm,4.5μm,5μm,7μm,8μm,10μm,12μm,15μm,18μm,20μm etc. It meets the customer’s requirements for product diversity and detection speed.
Solves the problem of ordinary lens, squint and deformation by using high-cost telecentric lens and special software test algorithm, which greatly enhances the inspection accuracy and inspection ability. Achieves the industry's leading static compensation for FPC warping.
Engineers with any levels of experience can independently program the system quickly and accurately through Gerber importing software module and the friendly programming interface. One-button operation by the operator is designed also greatly reduces the requirements for training.
MiniLED and MicroLED are composed of small LED lights. The number of small LEDs on a single board can reach more than 1 million pads. The size of a single unit of MiniLED is about 100-200μm, while the size of a single unit of MicroLED can be 50μm; therefore, the 3DSPI equipment used in high-dense products uses the highest configuration in the industry; especially the use of marble platforms, linear motors and linear encoder to ensure the movement accuracy of small-sized pads. Using the industry's leading 1.8μm resolution telecentric lens and optimizing Gerber conversion, Load Job, algorithm, data storage and query, etc., the accuracy, speed and efficiency of inspection are greatly improved.
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