Principle of Dry Ice Blasting

The principle of dry ice deburring/cleaning is that dry ice particles are driven by compressed air and impact the surface to be deburred at high speed. Dry ice is crushed and sublimated in an instant. Absorbs a lot of heat. Due to the difference in thermal expansion coefficient between the burr and the substrate, the burr cracks rapidly. The crushed dry ice particles enter the cracks, and due to the vaporization of the dry ice, its volume expands nearly 800 times in an instant. This creates a "micro-bomb" at the point of impact and the burrs are quickly stripped off for optimum cleaning results.

Dirt, burrs, etc. quickly crack and break away to achieve the effect of removal.

Technical Parameter

Dry ice cleaning advantages
1.Dry ice particles can be sprayed into microorganisms that are difficult to clean with traditional methods.
Small spaces, for very precise molds or product surfaces,It won't cause any damage at all.
2.High-density dry ice particles impact the surface more strongly,Release more kinetic energy to remove

stubborn stains quickly and efficiently effect.
3.The unique physical properties of dry ice make it the perfect cleaning medium. Dry ice is non-corrosive,

will not damage surfaces. Dry ice is sprayed at high speed.
4.It sublimates quickly after the surface of the object, and will not cause secondary pollution. No chemical

solvents are used in the entire cleaning process, making the working environment more environmentally

friendly and safer for workers.
5.Save time – no drying required, after cleaning the circuit boards are dry and ready for packaging.
6.Environmentally friendly – no toxic wastewater is produced. The removed residue is separated and discarded in the air filter.
7.Selective – no need to clean the entire PCB, only the side containing flux residue High sensitivity – removes flux residue without affecting the PCB structure

These advantages make dry ice (snow) cleaning an efficient, economical and environmentally friendly cleaning solution.

Machine structure diagram

Cleaning effect comparison